Dettagli del prodotto
Luogo di origine: GUANGDONG, CINA.
Marca: Kanglibang
Certificazione: Reach&Rosh
Numero di modello: L'indice di emissione è:
Termini di pagamento e spedizione
Quantità di ordine minimo: 1KG
Prezzo: Negotialbe
Imballaggi particolari: 150 g/Bottiglia, 300 g/Bottiglia, 800 g/Bottiglia
Tempi di consegna: 6-15 giorni
Termini di pagamento: T/T
Capacità di alimentazione: 100000
KL-UV-003 adhesive is a one-component, high-solid content, UV light and moisture dual-curing modified
polyurethane acrylate coating product. It is applied to the surfaces of printed circuit boards (PCB circuits),
electronic components, integrated circuits, etc., and can form a dense protective film to protect various
electronic components and soldering points. The protective film has excellent chemical resistance, surface
hardness, flexibility and moisture resistance.
Specificaiton:
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Applications:
It is used for coating the surfaces of printed circuit boards (PCB circuit boards), electronic components, integrated circuits,
etc. It can form a dense protective film to protect various electronic components and soldering points.
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Processing steps:
1. This product is sensitive to light. During storage and operation, it is necessary to control the exposure to various light
sources such as sunlight, UV light, and other artificial lighting sources.
2. Cleaning the surface to be coated is not mandatory when using this product. However, when contaminants such as
electronic devices, dust, salt, and oil are removed from the assembly board, the adhesion and reliability can be improved.
3. Coating methods that can be used include manual brushing, mechanical spraying, and mechanical dipping.
4. Curing: UV light curing typically has a wavelength of 365nm, with curing energy ranging from 1500 to 2000 mj/c㎡. The
coating film after UV curing should be dry. The coating film that has not been exposed to UV light needs 2 to 3 days for
moisture curing, and the performance of the coating film reaches its best after 120 hours. The glue that is not cured can
be removed with appropriate organic solvents such as isopropanol and ethyl acetate.