Industrial Adhesive High Temp Resistant Electronic Assembly Glue
Product Description
Hot Melt Adhesive
Featuring stable performance, KL-18 modified hot melt adhesive is easy to use, tack-free in daily environment and high-efficiency in thermal bonding.
Application
Specification
Name
KL-17 Hot Melt Adhesive
Appearance
Colorless clear liquid
Main Raw Material
Special resin
Viscosity
500 ± 200 cps
Solid Content
32 ± 3%
Coating thickness
5 μm / 10 μm / 20 μm
Hard drying time
2 min / 4 min / 7 min
Storage condition
0–15℃, avoid heat and direct sunlight
Operating Steps
1.Make certain there is no dust, oil or dirt left on material surfaces. 2. Evenly spread adhesive on substrates no matter by coating, printing or spraying. 3. Apply 90-110°C heating for 1-2 minutes to dry out solvents and water inside. 4. You may cool and attach release film for use within 6 months; or apply hot pressing then complete curing steps. 5. Check finished product performance after leaving it untouched for 24 hours.
Packing & Delivery
To grant superior safety to your goods, we arrange eco-friendly, standard, convenient and high-performance packaging services.